High-density integration of uniform sub-22 nm silicon nanowires for transparent thin film transistors on glass

Abstract

Ultrathin catalytical silicon nanowires (SiNWs), grown as orderly arrays upon glass substrates, are ideal 1D channels for the construction of high-performance field effect transistors for low-power and high aperture/transparency electronics. In this work, a rather uniform growth integration of high-density ultrathin SiNWs has been accomplished directly on glass substrate at 290 °C, via an in-plane solid–liquid-solid mechanism. The indium (In) catalyst thickness deposited on the dense guiding terrace steps was identified as a key parameter to suppress the size dispersion of the In droplets, and thus enable a uniform growth of ultrathin SiNWs with diameters down to DNW=21.8 ± 1.8 nm, a close-to-unity guided growth rate and an excellent transparency > 90 % in spectrum ranging from 350 nm to 950 nm. Based on a convenient dry plasma etching and low-temperature passivation procedure, high-performance SiNW transistors have been successfully fabricated upon a dense array of parallel SiNWs as channels with a narrow NW-to-NW spacing of 100 nm. A high current ratio Ion/Ioff > 107, a low off-state current down to 0.1 pA, a steep subthreshold swing of SS∼120 mV dec-1 and excellent positive and negative bias stabilities have been demonstrated, as well as SiNW-based inverter logics that achieve a gain of 14.6 V/V under a drive voltage of 2.25 V. These results highlight the potential of catalytic SiNWs to serve as advantageous 1D channels for large-area display or transparent electronics.