Abstract
Over 100 million silicon die have been built into HP Thermal Inkjet printheads and shipped to customers in the HP Scalable Printing Technology (HP SPT) platform since 2005. All these HP SPT printheads have a common attribute: the nozzle density and underlying power transistors are at 1200 nozzles per slot inch (NPSI). By re-engineering firing FET topology, simplifying nozzle logic and other circuit improvements, a new silicon platform has been developed that doubles the density of the underlying power transistors, resulting in 2400 NPSI on HP SPT in the new High Definition Nozzle Architecture (HDNA) platform. To address the increased demand for print data, the data rate between the print system and printhead silicon has been improved by a factor of three. The new printhead, the HP A53 Printhead, is form-factor compatible with the existing HP A51 Printhead and existing HP Inkjet Web Presses can be field-upgraded to use it. Its versatile nozzle configuration allows it to be reconfigured to exactly suit each application.
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