Abstract
Wedge locks have been widely used for effective spatial accommodation and easier integration of electronics. However, an increase in the dynamic displacement of the printed circuit board (PCB) with the increase in the board size is unavoidable because the wedge lock provides mechanical fixation only along the edge of the board. This is one of the technical issues in assuring the fatigue life of electronic packages under a severe vibration environment. However, application of a stiffener for the reduction of board displacement leads to an increase in the mass and volume of the electronics. In this study, for implementing lightweight and compact electronics, we proposed a high-damping PCB for effective vibration attenuation caused by high damping characteristics implemented by multi-layered viscoelastic acrylic tapes. The basic characteristics of the proposed PCB were obtained through free-vibration tests under various temperature conditions. Additionally, random vibration tests of PCB specimens with various layers of viscoelastic tapes were performed, and the fatigue life of electronic packages was compared to that of the specimen without tapes.
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