High current density triode magnetron sputtering

Abstract

There have been many attempts to use triode arrangements to improve sputtering systems. We present a version where the auxiliary cathode is not used to change the sputtering discharge but to create activated reactive ion plating conditions on the substrates. The system uses a high current density low voltage electron beam to activate metal vapour and reactive gases. The different geometric arrangements are presented. The electric and kinetic characteristics of the system are described and shown for the example of nitride deposition.