Abstract
Tin-antimony and tin-indium-antimony alloys made using relatively simple processing steps are discussed as potential creep-resistant, lead-free solders. The intermetallic SbSn forms a very advantageous distribution of high aspectratio whiskers, providing a significant composite strengthening effect that is relatively unaffected by aging at temperatures below 100°C. The intermetallic InSb is even more effective than SbSn per volume fraction. Evidently, strong interactions between dislocations and InSb particles are the origin of the creep-rate reduction. Compared to other potential creep-resistant solder alloys, the creep properties of the Sn-Sb and Sn-In-Sb alloys compare favorably, particularly the high volume-fraction Sn-Sb alloys. It is suggested that even better creep resistance could be achieved in alloys containing distributions of both InSb particles and SbSn whiskers.
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