High capacity, compact hybrid air cooling system

Abstract

This paper presents an innovative design for a high heat flux cooling system. The system's compact package includes a forced thermal spreader with a small pump, a manifold minichannel air heat sink, and an air mover. The forced thermal spreader can greatly reduce spreading thermal resistance, and bring uniform temperature distribution on a top surface - which will enhance the heat dissipation performance of the attached heat sink. The manifold minichannel air heat sink has low thermal resistance and a typical pressure drop. Most of the heat is transported from the chip to the liquid inside the forced thermal spreader. The liquid spreads the heat to the surface of the heat sink by circulating in the microchannels and minichannels inside the spreader. Some heat can also be transferred to the top surface via pure conduction from the mini- and micro-fins. Finally, the heat is transferred into the ambient environment by the uniquely-designed manifold heat sink. The system provides the cooling advantages of both liquid and air. Theoretical analysis and CFD simulation show this system can dissipate 500 W/cm of heat with a temperature rise of 50/spl deg/C above ambient, while it features a package that is small in size and light in weight.