High Capacitance Porous Ruthenium Nitride Films with High Rate Capability for Micro-Supercapacitors.

High electrical conductivity and breakdown current density of individual monolayer Ti3C2Tx MXene flakes

Highly conductive and mechanically strong microfibers are attractive in energy storage, thermal management, and wearable electronics. Here, a highly conductive and strong carbon nanotube/nanofibrillated cellulose (CNT–NFC) composite microfiber is developed via a fast and scalable 3D‐printing method. CNTs are successfully dispersed in an aqueous solution using 2,2,6,6‐tetramethylpiperidinyl‐1‐oxyl (TEMPO) oxidated NFCs, resulting in a mixture solution with an obvious shear‐thinning property. Both NFC and CNT fibers inside the all‐fiber‐based microfibers are well aligned, which helps to improve the interaction and percolation between these two building blocks, leading to a combination of high mechanical strength (247 ± 5 MPa) and electrical conductivity (216.7 ± 10 S cm−1). Molecular modeling is applied to offer further insights into the role of CNT–NFC fiber alignment for the excellent mechanical strength. The combination of high electrical conductivity, mechanical strength, and the fast yet scalable 3D‐printing technology positions the CNT–NFC composite microfiber as a promising candidate for wearable electronic devices.

Copper alloy No. 190 is an intermediate strength phosphor bronze having a combination of high electrical conductivity and endurance strength. It responds to an age hardening heat treatment offering an endurance strength of 39000 psi. It is recommended for springs, conductors, fasteners, etc. where a combination of high strength, high electrical and thermal conductivity, high resistance to fatigue and creep are required. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties as well as creep and fatigue. It also includes information on corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: Cu-206. Producer or source: Copper and copper alloy mills.

High-quality transparent conductive indium oxide film deposition by reactive pulsed magnetron sputtering: Determining the limits of substrate heating

Miniaturized power sources are key devices to get autonomous smart and connected sensors[1,2]. To reach this goal, the current trend is to fabricate micro-storage unit such as micro-batteries (MB) or micro-supercapacitors (MSC) at the wafer level. While binder or conducting agents are requested for bulk electrode synthesis, thin-film deposit technologies such as magnetron sputtering (MS) or atomic layer deposition (ALD) are versatile tools to provide binder free electrode that can be easily transferred to pilot production line. Moreover, this suitable technology is really attractive to study the intrinsic properties of electrode material for micro-devices. In this talk, we will show our recent results dealing with Nb2O5 and VN thin films deposited by MS or ALD either for planar or 3D micro-devices. Transition metal oxides thin films like RuO2 or MnO2 have been intensively studied[3–5] for MSC due to their pseudocapacitive properties. To improve the energy density of such MSC, moving from symmetric to hybrid micro-devices without scarifying the fast electrochemical process of the proposed system seems to be an interesting but challenging way from technological point of view. The electrochemical properties of the bulk Nb2O5 recently investigated[6–8] by B. Dunn et al have shown a fast pseudo-intercalation process of the lithium ion below 2 V vs Li/Li+ in orthorhombic T-Nb2O5. We have carried out in-depth study of Nb2O5 thin film to study the relationships between the synthesis parameters, the crystal structure and the electrochemical properties of this material. During the last ten years, transition metal nitride[9–11] have been investigated as an alternative for MSC electrode based on pseudocapacitance charge storage process due to their high electrical conductivity and anti-corrosion properties. We will show during this talk the preparation of vanadium nitride thin films with fine-tuned electrical, structural and electrochemical properties. Symmetric interdigitated MSC have been fabricated using microfabrication technique and tested in aqueous and protic ionic liquids electrolytes and the performance will be reported. The objective of these studies is to clearly find the suitable technology allowing to propose the fabrication of high areal energy density, small footprint area symmetric MSC or hybrid micro-devices before moving toward solid state configuration using ionogel technology.

All‐Solid‐State Cable‐Type Supercapacitors with Ultrahigh Rate Capability

Extensional flow-induced conductive nanohybrid shish in poly(lactic acid) nanocomposites toward pioneering combination of high electrical conductivity, strength, and ductility

Extensional flow-induced conductive nanohybrid shish in poly(lactic acid) nanocomposites toward pioneering combination of high electrical conductivity, strength, and ductility

Flexible micro-supercapacitors (MSCs) are promising power sources of portable/wearable electronic devices. Electrodes are the key components determining performance of the MSCs, but it still remains a big challenge in either materials or fabrication methods to achieve both high charge storage capability and robust mechanical flexibility. Herein, a novel water-cooling assisted selective laser ablation (WASLA) technique is demonstrated for scale-fabrication of "embedded-in-paper" 3D graphene-cellulose composite interdigital electrodes (3D GCCIEs) in a mask-free and chemical-free manner. The obtained electrodes are endowed with 3D charge storage geometry, high electrical conduction, freely designed patterns, and the inherent advantages of paper substrate. Therefore, the 3D GCCIEs-based MSC exhibits excellent overall performance including large specific capacitances, high rate performance, impressive cyclic stability, and remarkable mechanical flexibility. Moreover, metal-free 3D GCCIE-MSC integrated arrays with diverse shapes composed of linear/curved interdigital electrodes are also fabricated, and a letter-shaped MSC array successfully lit a light emitting diode light in both flat and folded status demonstrating excellent device flexibility. The as-fabricated 3D GCCIE-MSCs have shown great application potential as power sources of flexible electronic devices, and the WASLA method proves to be an effective strategy for scale-manufacturing high performance paper-based charge storage devices not limited to supercapacitors.

Recent advances in the development of self-powered devices and miniaturized electronics have increased the demand for on-chip energy storage devices that can deliver high power and energy densities in a limited footprint area. Here, we report the fabrication of all-solid-state micro-supercapacitors (MSCs) through a three-dimensional (3D) printing of additive-free and water-based MXene ink. The fabricated MSCs benefit from the high electrical conductivity and excellent electrochemical properties of two-dimensional (2D) Ti3C2Tx MXene and a 3D interdigital electrode architecture to deliver high areal and volumetric energy densities. We demonstrate that a highly concentrated MXene ink shows desirable viscoelastic properties for extrusion printing at room temperature and therefore can be used for scalable fabrication of MSCs with various architectures and electrode thicknesses on a variety of substrates. The developed printing process can be readily used for the fabrication of flexible MSCs on polymer and paper substrates. The printed solid-state devices show exceptional electrochemical performance with very high areal capacitance of up to ∼1035 mF cm-2. Our study introduces Ti3C2Tx MXene as an excellent choice of electrode material for the fabrication of 3D MSCs and demonstrates 3D printing of MXene inks at room temperature.

Sputtered transparent electrodes for optoelectronic devices: Induced damage and mitigation strategies

The aim of this study was to evaluate the effect of potassium silicate administration and of electrical conductivity of nutrient solution in three experiments against Colletotrichum gloeosporioides infection on basil (Ocimum basilicum L. cv Genovese Gigante) grown in a closed soilless system. Potassium silicate was added at 100 mg/l of nutrient solution at three different levels of electrical conductivity: 1.5–1.6 mS/cm (E.C.1), 3–3.2 mS/cm (E.C.2, 0.70 g/l NaCl) and 4–4.2 mS/cm (E.C.3, 0.95 g/l NaCl). Basil plants were inoculated with C. gloeosporioides spores 21–31 days after sowing or placing the pots on the channels, applying 5 ml of conidial suspension to each treatment. The increased electrical conductivity of the nutrient solution generally reduced the incidence and severity of the disease, with the highest electrical conductivity (E.C.3) providing the best results. The addition of potassium silicate to the different nutrient solutions showed a significant reduction in both incidence and severity of the disease compared to a solution without silicate and the best results were given by the addition of silicate with the highest electrical conductivity (E.C.3) in all the trials carried out. The combination of high electrical conductivity and potassium silicate supplied gave good results. The possibility and benefits of applying Si amendments in practice are examined.

Inhomogeneous copper matrix composites reinforced by RGO/Cu composite foams with high electrical conductivity, tensile strength and fracture elongation

<div class="section abstract"><div class="htmlview paragraph">To increase vehicle range, light weighting of electric vehicles has been extensively researched and implemented by using aluminum intensive solutions. With regards to traction motors, aluminum alloys that have a desired combination of high electrical conductivity and strength are required for high power output and efficiency. In this research, a novel Al-Ce based alloy, with minor additions of Si and Mg for strengthening, was investigated in different heat treatment tempers to maximize mechanical properties while maintaining a high electrical conductivity. This new alloy system appears to have addressed the classic conundrum of the inverse relationship of mechanical performance verses electrical conductivity for traditional aluminum alloy systems. The results suggest that the Al-Ce-Si-Mg alloy had yield strength in excess of 120 MPa and electrical conductivity of at least 50 %IACS in the T5 and T6 conditions. Simulations of a squirrel cage induction machine show that this combination of properties resulted in similar motor performance to other rotor Al alloys. As a result, the Al-Ce-Si-Mg alloy is a promising alternative to the near pure Al or Cu-based alloys that are currently used in induction motor rotor castings.</div></div>

In this work, the effect of KoBo extrusion process parameters on the extrusion force, microstructure, mechanical properties and electrical resistivity of wires fabricated from AA1070 commercially pure aluminum, is analyzed. It is found that applied parameters of the KoBo extrusion process have a strong impact on changes in the extrusion force. The smallest variation of the extrusion force was recorded for the KoBo extrusion conducted with a small oscillation angle and a high extrusion rate. The relatively small alteration of the extrusion force results in a more homogeneous microstructure and mechanical properties of the wires. As compared to the material in the annealed state, the KoBo extruded wires exhibit almost two-fold higher ultimate tensile strength and only a slightly lowered electrical conductivity. The best combination of electrical conductivity and mechanical strength was 60.3 % International Annealed Copper Standard and ultimate tensile strength of 152 MPa, respectively. These results are highly competitive to those reported for AA1070 aluminum subjected to other continuous plastic deformation methods (e. g. the cryorolling combined with a heat treatment). A high electrical conductivity and enhanced mechanical properties (in respect to the as annealed material), clearly indicate that the KoBo extruded AA1070 wires are potentially useful for moderately loaded electrical engineering applications.