Abstract
White color LED has been investigated for lighting application with a big expectation of growth. And in terms of packaging of them in general, clear transparent epoxy resin has been mainly used in spite of problems such as coloring of the resin due to high temperature and UV light emitted from Chip itself. In order to solve this problem, we have investigated new materials such as silicon resin and specially modified epoxy resin etc. And then we would suggest that materials should be chosen depending upon LED specifications, packaging materials and also reliability test conditions etc. In addition we would like to suggest high density packaging technology using VPES, which meets very fine pitch, high density packaging designs, and meets cost effective mass production.
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