Abstract
This paper reports a low-temperature thin-film encapsulation (TFE) process based on a low temperature atomic layer deposition ZrO2 layer for top-emission organic light-emitting devices (TEOLEDs). The barrier characteristics of TFE showed a lower water vapor transmission rate (WVTR) of 2.3 × 10−3 g/m2/day and a longer continuous operation lifetime of 6-folds compared to the device without TFE under identical environmental and driving conditions. Furthermore, the emitting light extraction of the device with barrier layers was improved compared to the bare device. The theoretical calculation data were consistent with the experimental results and showed the potential for designing optimized TFE structures for improving light transmission.
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