Abstract

This study presents a UV embossing process to fabricate high aspect ratio silver grid transparent electrodes on a polymer film. Transparent electrodes with a high optical transmittance (93 %) and low sheet resistance (4.6 Ω/sq) were fabricated without any high temperature or vacuum processes. The strong adhesion force between the UV resin and the silver ink enables the fabrication of silver microstructures with an aspect ratio higher than 3. The high aspect ratio results in a low sheet resistance while maintaining a high optical transmittance. Multi-layer transparent electrodes were fabricated by repeating the proposed UV process. Additionally, a large-area of 8-inch touch panel was fabricated with the proposed UV process. The proposed UV process is a relatively simple and low cost process making it suitable for large-area production as well as mass production.

Highlights

  • Transparent electrodes are key elements in optoelectronic devices such as touch panels, organic solar cells, smart windows, transparent heaters, etc.[1,2,3,4] They require high optical transmittance and low sheet resistance, which are determined by the materials, fabrication process, and pattern design used

  • Metal grids are considered as a promising alternative transparent electrode with high optical transmittance, low sheet resistance, and good flexibility

  • A high aspect ratio of metal grids is an essential requirement to achieve a low sheet resistance at high transmittance because metal grids have a trade-off between the optical transmittance and the sheet resistance

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Summary

Introduction

Transparent electrodes are key elements in optoelectronic devices such as touch panels, organic solar cells, smart windows, transparent heaters, etc.[1,2,3,4] They require high optical transmittance and low sheet resistance, which are determined by the materials, fabrication process, and pattern design used. High aspect ratio silver grid transparent electrodes using UV embossing process High aspect ratio silver grid transparent electrodes using UV embossing process Dong Jin Kim,[1] Mikyung Lim,[1] Seung S.

Results
Conclusion

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