Abstract
High average power, high repetition rate fem- tosecond lasers with lJ pulse energies are increasingly used for material processing applications. The unique advantage of material processing with sub-picosecond lasers is effi- cient, fast and localized energy deposition, which leads to high ablation efficiency and accuracy in nearly all kinds of solid materials. This work focuses on the machining of high aspect ratio structures in transparent dielectrics, in particular chemically strengthened Xensation TM glass from Schott using multi-pass ablative material removal. For machining of high aspect ratio structures, among others needed for cutting applications, a novel method to deter- mine the best relation between kerf width and number of overscans is presented. The importance of this relation for optimization of the machining throughput will be demonstrated.
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