Abstract

As commercialisation of MEMS continues, integrated MEMS devices are under development, whereby the MEMS and CMOS or BICMOS technologies are brought together on the same chip. This technique is an alternative to hybrid packaging, where the MEMS and CMOS components are manufactured separately and bonded to complete the device. The cost of processing integrated MEMS devices has been analysed, using the MEMSCOST spreadsheet, showing that the MEMS component is only a few percent of the overall cost of manufacturing, even when a High-Aspect-Ratio (HAR) process is employed and even less when test and packaging costs are taken into account.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.