Abstract
Integrated multiple degree of freedom (DOF) micro vibrating platform is an emerging approach for self-calibration of long-term drifts in scale factor and offset of multi-axis MEMS-based inertial measurement units (IMU). A 3-DOF piezoelectric micro vibrating platform based on PZT-SOI with high acceleration and angular velocity by wafer-level fabrication is presented. To achieve the motion of out-of-plane movement and X/Y plane tilt, the structural optimization of the supporting folded beams has been investigated and analyzed, aiming to keep the optimal balance between stiffness, elastic coefficient and system damping ratio for the vibrating platform. The IMU is integrated on the vibrating platform with electrical connection by a two-layer routing scheme by silicon dioxide isolation. The out-of-plane acceleration and X/Y tilting angular velocity of the integrated system reach up to 34.8 g and 2500°/s, respectively. The micro vibrating platform with high dynamic performances plays an important role in the applications for MEMS inertial sensors with high measurement ranges.
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