Hierarchical multi-porous copper structure prepared by dealloying electrolytic copper-manganese alloy

Abstract

This is the first report of the formation of a novel, hierarchical, three-level pore structure through the ordinary and simple processes of electroplating and dealloying. The co-deposition of Cu-Mn under certain conditions, allows the formation of Cu-rich and Mn-rich regions in unique distributions. By removing Mn and its oxides from the electrodeposited layer through dealloying, Cu with a hierarchical multi-porous structure is formed. This consists of wide and narrow macropore networks and mesopores. Notably, the growth of Cu and the resulting rapid depletion of Cu ions during the electroplating process are proposed to be the main reasons for the formation of interconnected pore networks. As the formation of this unique pore structure is essentially independent of the plating time (or the thickness of the deposited layer), and because it provides a very large surface area and open pore structure, its engineering practical applications particularly in functional chemistry and electrochemistry are expected to be significant in the future.