Hierarchical growth of Cu zigzag microstrips on Cu foil for superhydrophobicity and corrosion resistance

Abstract

Superhydrophobic films are regarded as promising barriers to protection metal substrates from corrosion. Herein, Cu zigzag microstrips have been kinetically synthesized on Cu foil via a facile electrodeposition at room temperature. The resulting microstrips show hierarchical micro-/nanostructures, i.e., zigzag nanotips on the microstrips, and follow a heterogeneous nucleation and kinetic growth mechanism. After modification with stearic acid, the zigzag-microstrip film exhibits a water contact angle of 167.0±1.8° and a sliding angle of 2.8±0.5° for a 5μL droplet due to its dual scale roughness together with the low surface energy. The superhydrophobic film shows good corrosion protection for the underlying Cu substrate. Tape peeling test shows the zigzag microstrips have a good adhesive strength because of its natural affinity to the Cu substrate. Our work may pave an alternative way to fabricate the superhydrophobic film, having the same phase as its metal substrate, with promising adhesion and corrosion resistance to the substrate.