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Abstract
In this paper a platform based on the composite IC concept (Semiconductor Industry Association in The NTRS, pp 63, 1994) will be presented that is optimized for high frequency applications. Key elements of the platform are coplanar waveguides and micro springs that are processed using MEMS technologies. Rotation symmetric micro springs with diameters between 500 and 125 μm with different widths and thicknesses were designed, simulated and fabricated. The best mechanical properties were obtained from springs with a diameter of 250 μm. They were made by electroplating of a nickel–tungsten-alloy. FEM simulation of the high frequency performance shows a good performance up to frequencies of 10 GHz.
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