Abstract

We investigate a group of Hf- and Zr-based dielectrics crystallizing in the cubic perovskite structure for memory applications. The dielectrics are deposited in the form of thin layers (<30 nm) onto TiN substrates using molecular beam deposition. Prepared layers are characterized with respect to their dielectric constant, crystallization temperature as well as some aspects of leakage current flowing across group-II hafnates and zirconates. We show that dielectric constants of about 40 can be achieved for BaHfO 3, BaZrO 3, and SrHfO 3 on TiN substrates. On an example of BaHf 1− x Ti x O 3, we demonstrate that a significant gain in the dielectric constant and capacitance density can be achieved by partial substitution of Hf atoms by Ti in BaHfO 3. This process leads also to a reduction of the crystallization temperature of the layers.

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