Abstract

We report a void defect in gallium nitride (GaN) and InGaN, revealed by aberration-corrected scanning transmission electron microscopy (STEM). The voids are pyramids with symmetric hexagonal {0001} base facets and {101¯1} side facets. Each pyramid void has a dislocation at the peak of the pyramid, which continues up along the [0001] growth direction to the surface. Some of the dislocations are hexagonal open core screw dislocations with {101¯0} side facets, varying lateral widths, and varying degrees of hexagonal symmetry. STEM electron energy loss spectroscopy spectrum imaging showed a large C concentration inside the void and on the void surfaces. There is also a larger C concentration in the GaN (or InGaN) below the void than above the void. We propose that inadvertent carbon deposition during metal organic chemical vapor deposition growth acts as a mask, stopping the GaN deposition locally, which in combination with lateral overgrowth, creates a void. Subsequent layers of GaN deposited around the C covered region create the overhanging {101¯1} facets, and the meeting of the six {101¯1} facets at the pyramid’s peak is not perfect, resulting in a dislocation.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call