Abstract
Introducing coarse grains into nanocrystalline (NC) and ultrafine grained (UFG) metallic materials can lead to an excellent combination of strength and ductility. In this study, we produced Al2O3 dispersion-strengthened (Al2O3-DS) Cu with heterogeneous microstructure by mechanical alloying (MA) of Cu-Al2O3 powder mixture followed by spark plasma sintering (SPS) and hot extrusion (HE). For direct comparison, one sample was prepared by hot extrusion only without prior SPS of mechanically alloyed (MAed) powders. The microstructure of materials produced via a combination of SPS and HE possessed the heterogeneous microstructure consisting of Al2O3-free coarse grained (CG) Cu bands and Al2O3-rich UFG Cu regions. These different microstructural regions were found to play different roles on the tensile and electrical properties and their presence can be tuned to achieve desired mechanical and electrical properties. We also discuss the possible mechanisms responsible for the formation of the heterogeneous microstructure in the samples produced by a combined process of SPS and HE.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.