Abstract

The development of ultralow-loss silicon-nitride-based waveguide platforms has enabled the realization of integrated optical filters with unprecedented performance. Such passive circuits, when combined with phase modulators and low-noise lasers, have the potential to improve the current state of the art of the most critical components in coherent communications, beam steering, and microwave photonics applications. However, the large refractive index difference between silicon nitride and common III-V gain materials in the telecom wavelength range hampers the integration of electrically pumped III-V semiconductor lasers on a silicon nitride waveguide chip. Here, we present an approach to overcome this refractive index mismatch by using an intermediate layer of hydrogenated amorphous silicon, followed by the microtransfer printing of a prefabricated III-V semiconductor optical amplifier. Following this approach, we demonstrate a heterogeneously integrated semiconductor optical amplifier on a silicon nitride waveguide circuit with up to 14 dB gain and a saturation power of 8 mW. We further demonstrate a heterogeneously integrated ring laser on a silicon nitride circuit operating around 1550 nm. This heterogeneous integration approach would not be limited to silicon-nitride-based platforms: it can be used advantageously for any waveguide platform with low-refractive-index waveguide materials such as lithium niobate.

Highlights

  • Owing to its wide optical transparency range, silicon nitride (Si3N4) has been recognized several decades ago as a suitable candidate for photonic integrated circuits (PICs)

  • Single-sided on-chip optical powers up to 350 μW are reached. This sub-milliwatt value can be explained by the combined effects of a low output coupling, cavity losses, and variability in the transfer printing alignment accuracy, which leads to a varying coupling efficiency between the III-V and the amorphous silicon (a-Si):H waveguides

  • In conclusion, we demonstrate a novel strategy for the heterogeneous integration of III-V amplifiers on a low refractive index platform

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Summary

INTRODUCTION

Owing to its wide optical transparency range, silicon nitride (Si3N4) has been recognized several decades ago as a suitable candidate for photonic integrated circuits (PICs). It was used in sensing applications at visible wavelengths. Microtransfer printing technology combines several advantageous aspects of wafer bonding and flip-chip integration It allows for an efficient use of the expensive active materials, massively parallel integration of pretested devices and the cointegration of diverse material stacks for different functionalities on a single target substrate [21].

DESIGN
Microtransfer Printing
Target Sample Preparation
Microtransfer Printing Process
DEVICE CHARACTERIZATION
Findings
CONCLUSION
Full Text
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