Heterogeneous diamond–TiC composites with high fracture toughness and electrical conductivity

Abstract

The concurrent enhancement of toughness, electrical conductivity, and thermal stability in polycrystalline diamond composites represents a formidable challenge. Here, a novel diamond-TiC composites (referred to as DTC) with high fracture toughness and conductivity were synthesized through a high-temperature and high-pressure reaction sintering process utilizing two precursors: diamond mixtures containing TiH2 and Ti-coated diamonds. On the one hand, the inherent bonding and encasing of TiC onto the diamond matrix form a heterogeneous structure, providing high strength and excellent fracture toughness up to 11.6 MPa·m1/2. On the other hand, the established oxygen barrier and current pathway offer a thermal stability of 765 °C and high conductivity up to 837 S·m−1. Remarkably, this rare combination of mechanical, electrical, and thermal properties has been realized within a single material under relatively moderate sintering conditions, thus positioning diamond-TiC composites as a promising ceramic for electrical applications in high-stress environments.