Abstract

This paper reports the effect of Silicon substrate orientation and Aluminum nitride buffer layer deposited by molecular beam epitaxy on the growth of aluminum nitride thin films deposited by a DC magnetron sputtering technique at low temperatures. The structural analysis has revealed a strong (0001) fiber texture for both Si(100) and (111) substrates, and a hetero-epitaxial growth on a AlN buffer layer, which is only a few nanometers in size, grown by MBE onthe Si(111) substrate. SEM images and XRD characterization have shown an enhancement in AlN crystallinity. Raman spectroscopy indicated that the AlN film was relaxed when it deposited on Si(111), in compression on Si(100) and under tension on a AlN buffer layer grown by MBE/Si(111) substrates, respectively. The interface between Si(111) and AlN grown by MBE is abrupt and well defined, contrary to the interface between AlN deposited using PVD and AlN grown by MBE. Nevertheless, AlN hetero-epitaxial growth was obtained at a low temperature (<250 °C).

Highlights

  • Aluminum nitride (AlN) thin films are integrated in surface acoustic wave (SAW) devices, where they insure high frequency ranges, a large electromechanical coupling factor (Ks2 ), and temperature stability of the respective device

  • We report on the growth of AlN films deposited at low temperatures on Si(100), Si(111), and on a 1-nm composite substrate of AlN buffer layer deposited by molecular beam epitaxy (MBE) on Si(111)

  • To realize the epitaxial growth of AlN, we proposed to cover the substrate by a 1-nm-thick AlN deposited by molecular beam epitaxy MBE on HF-cleaned 2-in.-diameter

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Summary

Introduction

Publisher’s Note: MDPI stays neutral with regard to jurisdictional claims in published maps and institutional affiliations. Aluminum nitride (AlN) thin films can be a promising candidate in optical, mechanical, and electronic applications. It can serve as a semiconductor when doped [1] and as a passivation layer for semiconductors [2]. AlN thin films are integrated in surface acoustic wave (SAW) devices, where they insure high frequency ranges, a large electromechanical coupling factor (Ks2 ), and temperature stability of the respective device

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