Abstract
In this study the feasibility of glass soldering of aluminium nitride (AlN) for the package of silicon carbide semiconductors with application temperatures up to 600°C was evaluated. The components used were various commercially available solder glasses and a crystallising three-component glass. Chemical compatibility between the glass and AlN was investigated by means of both thermodynamic calculations and experimental work on solder joints. The PbO-free three-component glass was stable against AlN. Lead oxide containing glasses showed deleterious reaction with AlN, which can be inhibited by a passivating layer. Additionally the influence of the processing parameters atmosphere and mechanical pressure was investigated. Hermeticity of sealed packages could be proved for three glasses allowing high temperature application between 500 and 600°C.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
