Abstract
China's next generation light source, named the High Energy Photon Source (HEPS), is currently under construction. HEPS-BPIX (HEPS-Beijing PIXel) is a dedicated pixel readout chip that operates in single photon counting mode for X-ray applications in HEPS. Designed using CMOS 0.13µm technology, the chip contains a matrix of 104×72 pixels. Each pixel measures 150µm×150µm and has a counting depth of 20bits. A bump-bonded prototyping detector module with a 300-µm thick silicon sensor was tested in the beamline of Beijing Synchrotron Radiation Facility. A fast stream of X-ray images was demonstrated, and a frame rate of 1.2kHz was proven, with a negligible dead time. The test results showed an equivalent noise charge of 115e−rms after bump bonding and a threshold dispersion of 55e−rms after calibration.
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