Abstract
It is true to say that additives for electroplating were discovered and not invented and largely by accident through acute observation. The first additive was noted in the mid 1840s soon after commercial electrodeposition was established and is believed to be carbon disulphide for cyanide silver plating. Thereafter a number were in use for copper, cadmium etc but interestingly never mentioned when Professor Watts was asked to optimise acid sulphate nickel in the 1910s, cathode efficiency and solution stability being much more important.
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