Abstract
ABSTRACT Spin-coated films of non-photosensitive engineering thermoplastics mixed with photosensitive agent diazonaphthoquinone (DNQ) can be imaged with near-UV light. The engineering thermoplastics selected for study are commercially available poly(bisphenol A carbonate), polyarylate (U polymer ) and polyetherimide (Ultem®), and synthesized fluorinated polyimide, which have no specific functional groups. Development with a solution includingethanolamine dissolves the irradiated areas to give positive fine patterns. The two-component photosensitive systemsshowed good photosensitivity and resolution (line/space 10/10 jim) with about 10-15 jim in thickness.Keywords: engineering thermoplastics, heat-resistant photoresists, diazonaphthoquinone, positive imaging, reactiondevelopment patterning 1. INTRODUCTION We recently proposed new type of photosensitive polyimides based on reaction development patterning (RDP), in which an ethanolamine-containing solution used as a reactive developer causes chemical main-chain scission of
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