Abstract

This research investigated heating uniformities of prepackaged bread loaf using combined radio frequency (RF) and hot air treatments to reduce mold growth. Experiments were conducted in a 6kW, 27.12MHz pilot-scale RF system. Effects of the gap between two RF plate electrodes, horizontal and vertical locations of bread loaf, as well as running speed of conveyor belt were studied. When the bread loaf was located in the center plane between the two electrodes 202mm apart, and on a conveyor belt moving at a speed of 1cm/s to reach a minimum sample temperature of 58°C, the temperature distribution within each slice was relatively uniform, with less than a 5°C difference. The cold spot was located at the core of the bread loaves. Higher surface temperature should be useful to assist in inactivation of molds that are commonly vegetated on the surface of the whole loaf.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.