Heat transfer in the FC-72 fluid rivulet flowing down a vertical heated foil

Tatyana Ponomarenko,Vyacheslav Cheverda,G.V Kuznetsov,P.A Strizhak,A.O Zhdanova

doi:10.1051/matecconf/20179201005

Abstract

The paper deals with the experimental study of heat transfer in FC-72 fluid revulet flowing down the vertical heated foil with the length of 80, width of 35 mm, and thickness of 25 microns, made of constantan. Employing infrared thermography, we have obtained data on temperature distribution on the foil from the opposite side of the rivulet flow. Further we will calculate the heat flux on the foil surface. It is experimentally revealed that the rivulet width reduces with increase in thermal power due to evaporation, while it increases with increasing fluid flow rate. The FC-72 fluid has good wettability and low latent heat of evaporation. Thus this fluid is recommended for use in cooling systems.

Highlights

As of today, one of the main objectives is the design of a highly efficient cooling system
In a similar study [8], which was conducted using water, the calculation of the heat flux from the foil was carried out using images from the IR scanner without taking into account heat fluxes in the foil
Cauchy problem describing the thermal conductivity in the foil was solved with due consideration of heat fluxes in the foil

Summary

Introduction

One of the main objectives is the design of a highly efficient cooling system. With each new processor model, the number of transistors increases approximately twice. Increase in the number of transistors improves many parameters of which processor performance is the main one. This leads to increase in thermal power that must be removed from the processor. The maximum heat generation in the microprocessor is approximately 500 W/cm. Microelectronics is only a small part of devices which require a compact and efficient cooling system

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Conclusion