Abstract
As heat generation from electronic components increase and the limit of air-cooling is reached, the interest for using liquid cooling for high heat flux applications has risen. Thermosyphon cooling is an alternative liquid cooling technique, in which heat is transferred as heat of vaporization from evaporator to condenser with a relatively small temperature difference. The effect of fluid properties, the structure of wall surfaces, and the effect of system pressure was investigated and reported previously by the author. In this paper, the influence of heat flux, system pressure, mass flow rate, vapor fraction, diameter of evaporator channel and tubing distance between evaporator and condenser on the heat transfer coefficient of an advanced two-phase thermosyphon loop is reported. The tested evaporators were made from small blocks of copper with 7, 5, 4, 3 and 2 vertical channels with the diameters of 1.1, 1.5, 1.9, 2.5, and 3.5 mm, respectively and the length of 14.6 mm. Tests were done with isobutane at heat fluxes ranging between 28.3 and 311.5 kW/m 2.
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