Heat Transfer from an Oxidized Large Copper Surface to Liquid Helium: Dependence on Surface Orientation and Treatment

Abstract

Heat transfer of large copper plates (18 × 76 mm) in liquid helium has been measured as a function of orientation and treatment of the heat transfer surface. The results relate to applications of large scale superconductors. In order to clarify the influence of the area where the surface treatment peels off, we studied five types of heat transfer surface areas including: (a) 100% polished copper sample, (b) and (c) two 50% oxidized copper samples having different patterns of oxidation, (d) 75% oxidized copper sample, (e) 90% oxidized copper sample, and (f) 100% oxidized copper sample. We observed that the critical heat flux depends on the heat transfer surface orientation. The critical heat flux is a maximum at angles of 0° – 30° and decreases monotonically with increasing angles above 30°, where the angle is taken in reference to the horizontal axis. On the other hand, the minimum heat flux is less dependent on the surface orientation. More than 75% oxidation on the surface makes the critical heat flux increase. The minimum heat fluxes of the 50 and 90% oxidized Cu samples approximately agree with that of the 100% oxidized Cu sample. Experiments and calculations show that the critical and the minimum heat fluxes are a bilinear function of the fraction of oxidized surface area.