Abstract

Heat sinks are widely adopted in electronics coolin g together with different technologies to enhance t he cooling process. For the small electronics applicat ion, the small scale pin fins heat sinks are extens ively used to dissipate heat in electronics devices. Due to the limit of space in the small devices, it is i mpossible to increase heat transfer area. In order to improve the heat transfer performance, the applying the fo rced vibration is one of challenging method. This study applies the vibration frequency between 50 to 1,000 Hz to pin fins heat sinks. The results of numerical si mulation clearly show satisfied heat transfer augme ntation. However, the Pressure drop significantly increases with frequency. This phenomenon affects the heat tr ansfer enhancement performance that it increases with freq uency until certain value then it drops rapidly. Th e results of this study can help designing heat sinks for ele ctronics cooling by employing the concept of vibrat ion.

Highlights

  • The power density of microchip has been increasing along with the rapid development in electronic technology

  • The small-scale pin-fin heat sinks with vibration effect are investigated

  • The heat transfer rate and pressure drop for 2D square pin fins heat sinks presents periodic pattern related to cycle of vibration

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Summary

INTRODUCTION

The power density of microchip has been increasing along with the rapid development in electronic technology. They showed a feasibility study to use force convection micro channel in electronic cooling This heat sink had every low thermal resistance. Thermal boundary layer was eliminated and new thermal boundary layer was formed These phenomena clearly improved the heat transfer performance. Fu and Tong (2002) used finite element method with ALE to study heat transfer characteristic from heated oscillating cylinder The parameters such as Reynolds number, oscillating amplitude and oscillating speed were considered. Ji et al (2008) performed experiment to investigate heat transfer enhancement from heated cylinder in a channel by pulsating flow. While block was moving, circulated flows were apparently generated at downstream This phenomenon results in the heat transfer enhancement inside channel especially at the downstream region. In order to improve heat transfer performance, the vibration in the small scale heat sink is the challenging issue to be considered

Governing Equations and Numerical Method
Geometry and Boundary Condition
Grid Independence Study
MATERIALS AND METHODS
Baseline Case
Effect of Frequency on 2D Square Pin Fin Heat Sink
Validation of Numerical Results
CONCLUSION
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