Abstract

Because the delta winglet in common-flow-down configuration has been recognized as an excellent type of vortex generators (VGs), this study aims to experimentally and numerically investigate the thermo-hydraulic performance of four different forms of winglet VGs featuring sweptback delta winglets in the channel flow in the range 200 < Re < 1000. Both Nusselt number and friction factor of plate-fin heat sinks having different forms of winglets, including delta winglet pair (DWP), rectangular winglet pair (RWP), swept delta winglet pair (SDWP), and swept trapezoid winglet pair (STWP), were measured in a standard wind tunnel without bypass in this study. Four rows of winglets with in-line arrangement were punched on each 10-mm-long, 0.2-mm-thick copper plate, and a total of 16 pieces of copper plates with spacing of 2 mm were fastened together to achieve the heat sink. The projected area, longitudinal and winglet tip spacing, height and angle of attack of those winglets were fixed. Besides that, three-dimensional numerical simulation was also performed in order to investigate the temperature and fluid flow over the plate-fin. The results showed that the longitudinal, common-flow-down vortices generated by the VGs augmented the heat transfer and pressure drop of the heat sink. At airflow velocity of 5 m/s, the heat transfer coefficient and pressure drop of plain plate-fin heat sink were 50.8 W/m2·K and 18 Pa, respectively, while the heat transfer coefficient and the pressure drop of heat sink having SDWP were 70.4 W/m2·K and 36 Pa, respectively. It was found that SDWP produced the highest thermal enhancement factor (TEF) of 1.28 at Re = 1000, followed by both RWP and STWP of similar TEF in the range 200 < Re < 1000. The TEF of DWP was the lowest and it was rapidly increased with the increase of airflow velocity.

Highlights

  • Power electronics such as thyristor, GTO, IGCT, power BJT, power MOSFET, and IGBT that are responsible for controlling and converting electrical power in the system have become widely used in response to the urgent demand of reducing the worldwide greenhouse gas emissions to retard the global warming

  • At air velocity of 5 m/s, the heat transfer coefficient of the plain plate-fin heat sink was about 50 W/m2 K, while that of the heat sinks having vortex generators (VGs) was between 67 W/m2 K and 70 W/m2 K

  • At air velocity of 5 m/s, the heat transfer coefficient of the plain plate-fin heat sink was about 50 W/m2K, while that of the heat sinks having VGs was between 67 W/m2K and 70 W/m2K

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Summary

Introduction

Power electronics such as thyristor, GTO, IGCT, power BJT, power MOSFET, and IGBT that are responsible for controlling and converting electrical power in the system have become widely used in response to the urgent demand of reducing the worldwide greenhouse gas emissions to retard the global warming. The application of power electronics related to the reduction of greenhouse gas emission includes integration of renewable resources into the power grid and the driving of motors for electric or hybrid electric vehicles, and so on. Effective thermal management is a key for reliable operation of power electronics [1,2,3,4,5,6]. The other is liquid cooling using water or dielectric fluid as working fluid. It is a cost effective way to cool the electronic devices using ambient fluid by attaching a forced air cooled heat sink to the casing of the electronic chip.

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