Heat transfer enhancement of a microchannel cooler with V-shaped partitions

Abstract

The ongoing evolution of electronic systems that operate under extreme conditions has led to persistent concern about potential failures caused by escalating temperature levels which provokes the decline the operating quality. In response to this challenge, cooling solutions based on microchannels have emerged as promising prospects for improving thermal management in such scenarios. This paper explores the importance of these innovative cooling techniques and their potential for mitigating the risks of overheating in electronic systems. Furthermore, the introduction of microfluidic techniques and microchannels, specifically constricted microchannels, offers promising approaches to improve cooling efficiency. These cooling systems enable efficient heat dissipation and thermal regulation, mitigating the risk of overheating and enhancing system performance. Constricted microchannels facilitate compact and efficient heat transfer by leveraging increased surface area-to-volume ratios and improved convective cooling. Nowadays, microchannel-based heat sinks, heat exchangers, and cooling systems have been developed, showcasing improved heat dissipation, reduced temperature gradients, and enhanced energy efficiency. This research focuses on a parametrical study that examines the fluid nature, Reynolds number analysis, and system design. Numerical results demonstrate successful thermal management of high-temperature electronic systems using constricted microchannel cooling. These results mitigate temperature-related failures and support the development of robust systems for harsh operating conditions.