Abstract

This work focuses on subcooled boiling heat transfer during flow in a minichannel heat sink with three or five minichannels of 1 mm depth. The heated element for FC-72 flowing along the minichannels was a thin foil of which temperature on the outer surface was measured due to the infrared thermography. The test section was oriented vertically or horizontally. A steady state heat transfer process and a laminar, incompressible flow of the fluid in a central minichannel were assumed. The heat transfer problem was described by the energy equations with an appropriate system of boundary conditions. Several mathematical methods were applied to solve the heat transfer problem with the Robin condition to determine the local heat transfer coefficients at the fluid/heated foil interface. Besides the 1D approach as a simple analytical method, a more sophisticated 2D approach was proposed with solutions by the Trefftz functions and ADINA software. Finite element method (FEM) calculations were conducted to find the temperature field in the flowing fluid and in the heated wall. The results were illustrated by graphs of local heated foil temperature and transfer coefficients as a function of the distance from the minichannel inlet. Temperature distributions in the heater and the fluid obtained from the FEM computations carried out by ADINA software were also shown. Similar values of the heat transfer coefficient were obtained in both the FEM calculations and the 1D approach. Example boiling curves indicating nucleation hysteresis are shown and discussed.

Highlights

  • The use of boiling phenomena is one of the ways of intensifying heat transfer

  • The minichannels relative difference between thefrom maximum ofand wyfrom for the thecomputations test section with three the Trefftz functions was equal to 7.3%, while at y = 16 mm it was less than 6.6%

  • This caused the increasing of heat flux transferred to the boiling fluid flowing in the minichannel

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Summary

Introduction

The use of boiling phenomena is one of the ways of intensifying heat transfer. Boiling heat transfer during flow in small size channels has great potential for large heat flux transfer due to the fact that it enables the meeting of conflicting requirements such as a high heat flux at minor temperature differences among the heated wall and saturated liquid, for slight dimensions of the heat transfer device. There is increasing interest on heat exchangers with mini- or microchannels due to these advantages mentioned above, resulting from their high process efficiency and compactness of technological solutions. It is worth mentioning that miniaturization combined with the increasing amount of transported heat is currently needed in most technical applications. This topic is widely recognized to be the key to the information technology industry for which heat flux in integrated chips is limited. Applications in advanced technology require heat fluxes as high as possible. Knowledge on a more efficient cooling technology based on mini- and microchannels is needed, and this is the reason for its rapid expansion

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