Heat transfer and the low limit of film boiling

Abstract

This paper presents a state-of-the-art review of film boiling heat transfer. Particular emphasis is given to heat transfer characteristics of film boiling in various kinds of liquids including liquid metals and to the enhancement of the low limit, T min, of film boiling for improving and controlling the cooling process. Experimental data of both liquid metals and nonmetallic liquids are compared with theoretical relationships of film boiling heat transfer. Intermittent and local liquid-solid contacts, which are directly detected, cause an earlier onset of transition from film to transition boiling during the cooldown of high-temperature metals coated with a thin layer of low thermal conductivity material. A model to evaluate the enhancement of T min is also mentioned.