Abstract

AbstractThe luminous efficiency of LED chip is related to its input power and junction temperature. When the junction temperature of LED chip exceeds a given value, its luminous efficiency will decline, and more electric energy will be converted into heat energy. Therefore, it is necessary to dissipate heat of LED chip. In this paper, in the design process of the heat sink of high-power LED lamp, several flat plate micro heat pipes are embedded among the fins. At the same time, an improved differential evolution algorithm is used to complete the design of the whole heat sink. The experimental results show that compared with the conventional heat sink design method, the proposed method in this paper can better reduce the junction temperature of LED chip, and obtain better thermal transfer performance.KeywordsLED lampThermal analysisDissipate heatDifferential evolution algorithmHeat pipes

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.