Heat‐resistant adhesive resins derived from bismaleimides and bisnadimides containing amide linkages

Abstract

AbstractA novel class of bismaleimides and bisnadimides containing amide linkages in their backbones were synthesized and characterized. The synthesis of these polymer precursors was carried out by reacting a diamine containing amide linkages with maleic/nadic anhydride. They were alternatively prepared by reacting the monomaleamic/monoadiamic acid of an aromatic diamine (1 mol) with terephthaloyl chloride (0.5 mol) and subsequent cyclodehydration. The latter new preparation method circumvented the hydrogeneration necessary in the first method of synthesis. The monomers were characterized by infrared (IR) and proton nuclear magnetic resonance (1H‐NMR) spectroscopy. Differential thermal analysis (DTA) of monomers showed that bisnadimide and bismethylnadimide were polymerized at lower temperatures than the corresponding bismaleimide. Thermogravimetric analysis (TGA) in nitrogen and air atmosphere revealed that all polymers were stable up to 321–363°C. Their char yield at 800°C under anaerobic conditions was 49–67%.