Heat dissipation of high-power light emitting diode chip on board by a novel flat plate heat pipe

Abstract

A new flat plate heat pipe (FPHP) which has many parallel-arranged micro-fins casted on the condensation surface was designed and fabricated. An experimental system for studying the thermal performance of this FPHP when applied for cooling high-power LED (light emitting diode) COBs (chip on board) was also set up. From experiments, the new FPHP is found to be more effective for heat dissipation of high-power LED COBs than the traditional FPHP. The thermal resistance of the new FPHP is 10–15% lowered and the temperature uniformity at the condensation surface of FPHP is approximately at the same level in comparison with the traditional FPHP. Numerical simulation with respect to LED COB cooling by the new FPHP was performed additionally. The obtained simulation results accord well with the experimental results, inter-proving the reliability of the obtained results and further corroborating the effectiveness of the new FPHP as applied for heat dissipation of high-power LED COBs.