Heat dissipation analysis on the designed inner-outer circulation impingement double-layer microchannel heat sinks with chamfers in power electronic cooling system

Abstract

This study discusses a new design which utilizes chamfers to further improve the thermal performance of inner-outer circulation impingement double-layer microchannel heat sinks by simulations and experiments manufactured with 3-Dimension printing. In contrast to former designed inner-outer circulation impingement double-layer microchannel heat sinks, inner-outer circulation impingement double-layer microchannel heat sinks with chamfer shows significant advantages in improving overall thermal performance in power electronic cooling. The results of simulation are in good agreement with those of experiment in five 3-Dimensional printing tests. It is demonstrated that the introduction of chamfers is effective in controlling the thermal gradient on substrate of heat sinks, and reducing the peak temperature on substrate of inner-outer circulation impingement double-layer microchannel heat sinks with chamfer as a result. The best performance is presented by a 0.2 mm chamfer located on the corner of the inner-outer circulation shaft in inner-outer circulation impingement double-layer microchannel heat sinks with chamfer. Experimental studies and numerical simulations both indicate that inner-outer circulation impingement double-layer microchannel heat sinks with a 2 mm chamfer significantly enhances heat transfer characteristics. In addition, the average Nusselt number for inner-outer circulation impingement double-layer microchannel heat sinks with a 2 mm chamfer is higher than that of other tests. Moreover, inner-outer circulation impingement double-layer microchannel heat sinks with a 2 mm chamfer performs better than other designs in terms of the overall heat transfer performance, which is significantly better than inner-outer circulation impingement double-layer microchannel heat sinks without chamfers.