Abstract
This paper deals with a study of three methods for health index (HI) extraction in semiconductor manufacturing equipments. The first method uses degradation reconstruction-based identification with basic principal component analysis (PCA), the second one uses multiway PCA and the last one extracts HI from the significant points related to degradation. A comparison of these methods are made discussing about their efficiency and shortcoming for the implementation. The studied methods are applied on two data sets: 1) a simulation case and 2) a real case provided by ST-Microelectronics, where experimental results highlight the advantages and limits of each one.
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