Abstract
Molecular dynamics (MD) simulation has been performed to demonstrate the fate of cracks present inside ultrafine-grained (grain size ~ 7 nm) nanocrystalline Ni specimen during creep deformation process. It is observed that internal nanocracks are healed within a few pico-seconds of initial part of creep process even if the constant applied load on the specimen is tensile in nature and acting normal to crack surface in the outward direction. This kind of crack-healing phenomenon can be accounted by the facts such as stress-driven grain boundary migration, grain boundary diffusion and amorphization of specimen as per results obtained from this MD simulation. This MD study also reveals that the presence of nanocrack inside ultrafine-grained NC Ni in fact slightly improves creep properties and such enhancement of the creep properties is intensified as the size of internal crack increases.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
