Abstract
A communication headset has an earpiece assembly mounted on one end of an arcuate headband having a single-piece integral, unitary construction and a resilient composition. The earpiece assembly includes an earmuff which engages a user's ear and which receives a speaker and speaker holder. The speaker holder is mounted rotatably to an interface module which in turn is mounted to a microphone module. An end cap engages the interface module and the microphone module. The mounting structure for attaching the microphone module to the interface module enables free 360° rotational movement of the microphone module relative to the interface module about a central axis transverse to the interface module. A temple piece is disposed on the opposite end of the headband for engaging the user's temple. The inventive method for making the headband of the headset includes the steps of forming a rigid outer band member by flowing molten thermoplastic material into a mold, and curing the molten material to form a rigid, springy outer band member; transferring the outer band member to another mold; and flowing molten thermoplastic material into said another mold into engagement with the members, and then curing the molten material to form a cushiony inner member fused to the outer member.
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