“Has Microelectronic MCM Technology Matured and is it Capable of Servicing the Widespread Needs of Down Well 225°C Operating Applications in the Oil and Gas Industry?”

Abstract

This paper reviews development and qualification work performed on 225°C operating temperature modules based on ceramic thick film multi-layer substrates supporting embedded thick film resistors, assembled passive and active components with ‘chip and wire’ connections and sealing in hermetic metal and ceramic cavity packages. It considers aspects of development and importantly investigates product qualification which includes shock and vibration at elevated temperatures as well as thermal shock and temperature cycling. In conclusion there is an attempt to answer the question “Has microelectronic MCM technology matured and is it capable of servicing the widespread needs of down well 225 °C operating applications in the Oil and Gas industry?”