Abstract
BGA package is selected as the research object in this paper. Workbench (finite elemental analysis tool in ANSYS) is used for harmonic response analysis. The author lays several paper sheets on the sample and builds the finite element model of clamp, ceramic and metal plate. Then, the model analysis is carried out. Based on this, it is converted to harmonic response analysis. According to the results, the author has found that there is no relation between the number of paper sheets and acceleration-frequency result. It promotes the development of electronic packaging reliability.
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