Abstract
Purpose – The purpose of this paper is to review the advancements in development of high aspect ratio microfabrication (HARM) type of micro-electro-mechanical systems (MEMS) reed switch sensors for much improved performance in a much more compact package. Design/methodology/approach – The paper presents an in-depth review of a number of applications of HARM built MEMS reed switches and consultation with a manufacturer. Findings – One manufacturer has introduced a totally new way to fabricate reed switches which brings numerous benefits such as reliability, higher voltage capability, lower contact resistance and other features in a new tiny package. Practical implications – Manufacturers of devices needing the benefits of the reed switch concept but who need a much smaller and compact switch now have a new option to explore. Originality/value – An expert insight into how to solve reed switching problems where space is at a premium.
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