Abstract
TECHNOLOGIES A. Adhesive and Anodic Bonding Glass Frit Wafer Bonding Wafer Bonding Using Spin-On Glass as Bonding Material Polymer Adhesive Wafer Bonding Anodic Bonding B. Direct Wafer Bonding Direct Wafer Bonding Plasma-Activated Bonding C. Metal Bonding Au/Sn Solder Eutectic Au-In Bonding Thermocompression Cu-Cu Bonding of Blanket and Patterned Wafers Wafer-Level Solid-Liquid Interdiffusion Bonding D. Hybrid Metal/Dielectric Bonding Hybrid Metal/Polymer Wafer Bonding Platform Cu/SiO2 Hybrid Bonding Metal/Silicon Oxide Hybrid Bonding APPLICATIONS Microelectromechanical Systems Three-Dimensional Integration Temporary Bonding for Enabling Three-Dimensional Integration and Packaging Temporary Adhesive Bonding with Reconfiguration of Known Good Dies for Three-Dimensional Integrated Systems Thin Wafer Support System for above 250 C Processing and Cold De-bonding Temporary Bonding: Electrostatic
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