Abstract

Halogen bond (X-bond) interactions involving organic iodine have been investigated using data retrieved from the Cambridge Structural Database (CSD) and Density Functional Theory (DFT) calculations. The analysis of the mean normalised intermolecular distances involving Csp–I, Csp2–I and Csp3–I X-bond donors first shows that, for interactions with the same acceptor site, the shortest mean distance is always measured for Csp–I X-bond donors. This experimental trend is rationalised through molecular electrostatic potential calculations on the iodine surface, along the σ-hole of the iodine atom, since Csp–I donors are characterised by the strongest VS,max values, that is to say the more electron poor iodine atoms. In agreement with the trends revealed from the analysis of the I⋯N distances, the X-bond with Csp–I donors appear more linear (mean of 169.5°) than with Csp2–I and Csp3–I donors, their respective values being close to 164°. From a survey of the geometries of the X-bond contacts observed in the most extended dataset (Csp2–I: 1213), a crystallographic order of X-bond acceptor strength has been obtained through a careful consideration of the chemical functions and subfunctions to which the acceptor atom belongs. This order is in good agreement with the one observed in solution on the diiodine basicity scale pKBI2. An exception to this trend is thioureas, which show unexpected long (weak) S⋯I distances. However, these observations are rationalised from the sulfur behaviour, which acts simultaneously as a X-bond acceptor and hydrogen-bond (H-bond) acceptor in these structures. Finally, an interesting correlation between the pKBI2 and the I⋯Y normalised intermolecular distances is found for a wide and varied collection of organic bases, since we have been able to delineate 22 families of organic compounds covering more than four pK units on the pKBI2 scale.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.