Abstract
A half-air-filled substrate-integrated groove-gap waveguide is proposed for millimeter-wave and terahertz applications. The waveguide is constructed by a ball grid array using a flip-chip technique without metallic vias with lightweight and low profile. The possible leakage perpendicular to the groove is prevented by solder balls as modeled by an equivalent circuit. Besides, an inline transition between the proposed waveguide and a microstrip line is proposed, fabricated, and measured. The design concept and working mechanism are explained. Good agreement between simulation and measurement is observed. The simulation shows that the proposed waveguide can cover the entire ${W}$ -band (70–118 GHz), and the measurement demonstrates that the proposed transition can operate at 90–98.8 GHz.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: IEEE Transactions on Microwave Theory and Techniques
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
