Abstract

This special issue showcases articles written from five of the best presentations at the Hot Chips 19 conference, held in August 2007. The guest editors give highlights of the conference and introduce the articles, which cover the mobile-optimized northbridge of AMD's Griffin microprocessor family; the IBM z10 next-generation mainframe microprocessor; fault tolerance in IBM's Power6 microprocessor; NVIDIA's Tesla unified graphics and computing architecture; and SiBEAM's 4-Gbps 1080p-capable uncompressed HD A/V wireless 60-GHz transceiver chipset.

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