Abstract
We are pleased to introduce this special issue of IEEE Micro, featuring articles that capture the latest results on high-performance interconnection networks, including some of the best presentations from last summer's Hot Interconnects 13 at Stanford University. Hot Interconnects provides a unique international forum for researchers and developers of state-of-the-art hardware and software architectures for interconnection networks at all scales, ranging from on-chip processor-memory interconnects to high-performance networks for the largest and most powerfulsupercomputers.
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